Transient Thermal Resistance Measurement System
Features
- This system was developed by ITRI and won the 2014 R&D 100 Awards.
- The complete thermal structure of the LED package components can be measured in as little as 3 minutes.
- Suitable for a variety of package LEDs.
- Flexible clamps are more reproducible than T3ster.
Specifications
| Transient Thermal Resistance Measurement System | |
| Current drive item | |
| Output current | 1mA~2A |
| Output voltage | 0~20V |
| Output channel | 1 |
| Voltage measurement item | |
| Sampling speed | 1MS/s ADC |
| Resolution | 16bits ADC |
| Sampling channels | 1 |
| Software item | USB |
| Software item | |
| △T, Zth, R-C Structure diagram (differential/integral) | Yes |
| Cooling system | |
| TEC Source | 15°C~85°C or 150°C |
| TEC Mount | 30W capacity @ 25°C |
Applications
Provide basic data in the form of engineer datasheet or simplified model.
Describe the thermal performance level of the component on the package, PCB board and system.
Assist process engineers in packaging and die-bonding quality inspection.
Assist design engineers to evaluate the thermal performance of package, thermal interface and PCB board.
Added to your inquiry
Transient Thermal Resistance Measurement System
Transient Thermal Resistance Measurement System